| Mfg Part Number: DP05072-000 | Alternate P/N: DP05072000 | NSN : 5961-01-350-1245 |
| NIIN : 013501245 | CAGE Code : 54558 | Manufacturer: Sdi Inc |
| Item Name : Semiconductor Device Diode | FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for your continued interest in the parts associated with the NSN 5961-01-350-1245, those of which are readily available for purchase on Automatize Electronics. The Semiconductor Device Diode item associated with the part number DP05072-000, by Sdi Inc, is currently available on our database; thus, if you wish to begin the part number DP05072-000 procurement process, we ask that you please fill out and submit an Instant RFQ form detailing your requirements on parts needed. This includes desired quantities, target prices, expected shipping time frames, and more, as applicable. Upon receival, our representatives will harness your provided information and formulate a solution which satisfies your operational needs in just 15 minutes or less.
With our global supply chain stretching across the United States, Canada, and the United Kingdom, Automatize Electronics can provide expedited shipping on select NSN products with the CAGE Code 54558, strategically assisting entities facing an Aircraft on Ground (AOG) situation or other unique time constraint. Operating with a strict NO CHINA SOURCING pledge, all items are shipped alongside their manufacturer trace documentation or qualifying certifications, ensuring that customers feel confident in every purchase made. With cost savings and rapid lead times bolstering every order, experience all of what Automatize Electronics has to offer on products with the NSN 5961-01-350-1245 by submitting your RFQ for parts by Sdi Inc. submit a quote for the part number DP05072-000, today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-350-1245 Item Description: Semiconductor Device Diode | 5961 | 013501245 | 0 | N | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | G | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Dp05072-000 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 0.016 INCHES NOMINAL |
| ABKW | OVERALL HEIGHT | 0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.016 INCHES NOMINAL |
| AFZC | FUNCTION FOR WHICH DESIGNED | SWITCHING |
| CBBL | FEATURES PROVIDED | MOUNTING PAD |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES FORWARD CURRENT, AVERAGE PEAK |
| CTRD | POWER RATING PER CHARACTERISTIC | 200.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR MINIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 85.0 DEG CELSIUS AMBIENT AIR |
| FEAT | SPECIAL FEATURES | THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO A GOLD PLATED ALUMINUM GROUND PLANE USING A CONDUCTIVE SILVER FILLED EPOXY; JUNCTION PATTERN ARRANGEMENT: PN |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.1 MAXIMUM |
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