| Mfg Part Number: MF28F010-25 B | Alternate P/N: MF28F01025B | NSN : 5962-01-381-9479 |
| NIIN : 013819479 | CAGE Code : 7U050 | Manufacturer: Intel Corporation |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your continued interest in the parts associated with the NSN 5962-01-381-9479, those of which are readily available for purchase on Automatize Electronics. The Microcircuit Memory item associated with the part number MF28F010-25 B, by Intel Corporation, is currently available on our database; thus, if you wish to begin the part number MF28F010-25 B procurement process, we ask that you please fill out and submit an Instant RFQ form detailing your requirements on parts needed. This includes desired quantities, target prices, expected shipping time frames, and more, as applicable. Upon receival, our representatives will harness your provided information and formulate a solution which satisfies your operational needs in just 15 minutes or less.
With our global supply chain stretching across the United States, Canada, and the United Kingdom, Automatize Electronics can provide expedited shipping on select NSN products with the CAGE Code 7U050, strategically assisting entities facing an Aircraft on Ground (AOG) situation or other unique time constraint. Operating with a strict NO CHINA SOURCING pledge, all items are shipped alongside their manufacturer trace documentation or qualifying certifications, ensuring that customers feel confident in every purchase made. With cost savings and rapid lead times bolstering every order, experience all of what Automatize Electronics has to offer on products with the NSN 5962-01-381-9479 by submitting your RFQ for parts by Intel Corporation. submit a quote for the part number MF28F010-25 B, today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-381-9479 Item Description: Microcircuit Memory | 5962 | 013819479 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Mf28f010-25 B | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.810 INCHES MINIMUM AND 0.830 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.404 INCHES MINIMUM AND 0.416 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.132 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND W/DISABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 28 INPUT" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES REVERSE CURRENT, DC BLANK" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | FLASH EEPROM" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | EEPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 FLAT LEADS" |
| ADAQ | BODY LENGTH | 0.810 INCHES MINIMUM AND 0.830 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.404 INCHES MINIMUM AND 0.416 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.132 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND MONOLITHIC AND W/ENABLE AND W/DISABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 28 INPUT" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES REVERSE CURRENT, DC BLANK" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | FLASH EEPROM" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | EEPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 FLAT LEADS" |
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